Semiconductor device

摘要

Embodiments of the inventive concept include a semiconductor device having a circuit board including a first outer layer, a contact region in the first outer layer, a second layer formed on an opposite side of the first outer layer, a via-hole, and a plurality of inner layers formed to be stacked between the first layer and the second layer. A case may accommodate the circuit board. The case may have a projection portion that is configured to come in contact with the circuit board in the contact region. The plurality of inner layers may include a ground layer. The first outer layer may be connected to the ground layer through a via-hole. The case may be connected to the ground layer through the first outer layer.

主权项

1. A semiconductor device, comprising:
a circuit board including a first outer layer, a contact region in the first outer layer, a second layer formed on an opposite side of the first outer layer, at least one via-hole, and a plurality of inner layers formed to be stacked between the first layer and the second layer; and a case accommodating the circuit board, the case having a projection portion that is configured to come in contact with the circuit board in the contact region, wherein the plurality of inner layers includes at least one ground layer, the first outer layer is connected to the at least one ground layer through the at least one via-hole; and the case is connected to the at least one ground layer through the first outer layer, wherein the circuit board comprises a stiffener that is formed between the first outer layer and the second outer layer, and the stiffener penetrates the plurality of stacked inner layers.