CONTACT TYPE IMAGE SENSOR

摘要

PURPOSE:To contrive the improvement of the reliability of the title sensor and a reduction in the cost of the sensor by a method wherein semiconductor image sensor chips are bonded and fixed on a light-transmitting insulating substrate having a circuit conductor layer with a light-transmitting die bonding agent and information light is emitted on a photodetecting element through the rears of the sensor chips passing through the side of the substrate. CONSTITUTION:A plurality of pieces of semiconductor image sensor chips 3 are bonded and fixed on a light-transmitting insulating substrate 1 having a circuit conductor layer 2 in a linear form with a light-transmitting bonding agent 5 and the chips 3 and the layer 2 are electrically connected to each other by fine metal wires 6. Information light 11 which is reflected light from a manuscript is emitted on a photodetecting element array 4 through the rears of the sensor chips 3 passing through the substrate 1 to obtain a time series electrical signal. By emitting the light 11 through the rear is such a way, a cover glass becomes unnecessary because protection of the chips 3 is obtained by molding the chips with a low-cost resin and the improvement of the reliability of humidity resistance, mechanical vibration and the like of a contact type image sensor and a reduction in the size of the sensor are contrived.