发明名称 |
ELECTRONIC PACKAGES AND SMART STRUCTURES FORMED BY THERMAL SPRAY DEPOSITION AND METHOD OF MAKING SAME |
摘要 |
A smart structure or an electronic package is formed by thermal spraying utilizing a plurality of masks positioned and removed over a work surface in accordance with a predetermined sequence. The masks correspond to cross sections normal to a centerline through the structure. Masks are placed above a work surface and sprayed with either at least one primary material to form at least one electronic component and a complementary material. In this manner, layers of material form a block of deposition material and complementary material. Then, the complementary material which serves as a support structure during forming may be removed. |
申请公布号 |
CA2073787(A1) |
申请公布日期 |
1993.01.16 |
申请号 |
CA19922073787 |
申请日期 |
1992.07.14 |
申请人 |
PRINZ, FRITZ B.;WEISS, LEE E.;SIEWIOREK, DANIEL P. |
发明人 |
PRINZ, FRITZ B.;WEISS, LEE E.;SIEWIOREK, DANIEL P. |
分类号 |
H01L21/56;B22F3/115;B29C67/00;H01L21/00;H01L23/08;H05K3/14;H05K3/46;(IPC1-7):H05K5/00 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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