WAFER SCALE SEMICONDUCTOR DEVICE

摘要

A wafer scale semiconductor device provides a bonding pad, the bonding pad comprising: an electrically floating conductor layer (13) contactable with a bonding wire, an insulating layer (22) formed under the conductor layer, and a buffer layer (21) formed under the insulating layer in a manner that the shape of the buffer layer corresponds to that of the conductor layer the buffer layer adsorbing an applied shock.