发明名称 |
SYSTEM FOR OVER-MOLDED PCB SEALING RING FOR TEC HEAT EXCHANGERS |
摘要 |
A thermoelectric-based air conditioning system is provided. The system includes at least a first supply air channel and a separate second supply air channel disposed in a housing. The system also includes a first thermoelectric cooler (TEC) assembly forming at least a portion of the first supply air channel and configured to independently condition air within the first supply air channel. The system further includes a second TEC assembly forming at least a portion of the second supply air channel and configured to independently condition air within the second supply air channel. The system includes a printed circuit board (PCB) for each of the first and second TEC assembly, wherein each of the PCSs are configured to provide an electrical connection between a first TEC and a second TEC with each of the first and second TEC assemblies. The system further includes a mold substrate configured to over-mold the first and second TECs of the first and second TEC assemblies. |
申请公布号 |
EP3107423(A1) |
申请公布日期 |
2016.12.28 |
申请号 |
EP20150749432 |
申请日期 |
2015.02.17 |
申请人 |
Marlow Industries, Inc. |
发明人 |
GIRAUD, Michael;MISHLER, Jeremy |
分类号 |
A47C21/04 |
主分类号 |
A47C21/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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