| 发明名称 |
RELEVANT SYSTEM, DEVICE AND METHOD INCLUDING POWER AMPLIFIER MODULE |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a power amplifier module for use in wireless communication.SOLUTION: A power amplifier module includes a power amplifier configured to supply an amplified RF signal by receiving a wireless frequency (RF) signal, and a wire bond pad connected electrically with the power amplifier. The wire bond pad includes a nickel layer having a thickness less than 0.5 μm, a palladium layer on the nickel layer, and a gold layer on the palladium layer. The power amplifier module further includes a conductive trace, and the conductive trace includes an upper surface part having a plating part and a non-plating part surrounding the plating part, and the wire bond pad is arranged on the plating part.SELECTED DRAWING: Figure 4 |
| 申请公布号 |
JP2016225642(A) |
申请公布日期 |
2016.12.28 |
| 申请号 |
JP20160154503 |
申请日期 |
2016.08.05 |
| 申请人 |
SKYWORKS SOLUTIONS INC |
发明人 |
HOWARD E CHEN;GUO YIFAN;DINHPHUOC VU HOANG;MEHRAN JANANI;KO TIN MYINT;PHILIP JOHN LEHTOLA;ANTHONY JAMES LOBIANCO;HARDIK BHUPENDRA MODI;HOANG MONG NGUYEN;MATTHEW THOMAS OZALAS;SANDRA LOUISE PETTY-WEEKS;MATTHEW SEAN READ;JENS ALBRECHT RIEGE;DAVID STEVEN RIPLEY;SHAO HONGXIAO;SHEN HONG;SUN WEIMIN;SUN HSIANG-CHIH;PATRICK LAWRENCE WELCH;PETER J ZAMPARDI JR;ZHANG GUOHAO |
| 分类号 |
H01L21/331;H01L21/3205;H01L21/768;H01L21/82;H01L21/822;H01L21/8222;H01L21/8248;H01L23/522;H01L25/07;H01L25/18;H01L27/04;H01L27/06;H01L29/737 |
主分类号 |
H01L21/331 |
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