SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device in which a wiring distance between a substrate and a semiconductor chip is smaller than ever before.SOLUTION: A semiconductor device 1 comprises: a first substrate 10 including a first semiconductor chip 40 mounted on one surface and a first pad 12 extending to the outside of an outer shape of the first semiconductor chip 40; a second substrate 20 which is laminated above the first substrate 10 and includes a second pad 23; and a columnar substrate connection member 30 which is provided between the first substrate 10 and the second substrate 20, for electrically connecting the first substrate 10 and the second substrate 20. The substrate connection member 30 is obliquely disposed between the first pad 12 and the second pad 23, and one end is bonded with the first pad 12 and the other end is bonded with the second pad 23.SELECTED DRAWING: Figure 1