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发明名称
MULTI CHIP PAKAGE AND OPERATING METHOD THEREOF
摘要
다수의 반도체 장치를 구비하는 멀티 칩 패키지에 관한 것으로, 각각 고유 값에 따라 어드레스가 지정되는 다수의 반도체 장치, 및 상기 어드레스에 따라 상기 다수의 반도체 장치 각각을 활성화시켜 노말 동작을 수행하도록 제어하기 위한 컨트롤러를 구비하는 멀티 칩 패키지가 제공된다.
申请公布号
KR20160149783(A)
申请公布日期
2016.12.28
申请号
KR20150087406
申请日期
2015.06.19
申请人
에스케이하이닉스 주식회사
发明人
왕종현
分类号
H01L25/065;H01L27/108
主分类号
H01L25/065
代理机构
代理人
主权项
地址
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