Method of surface-mounting components

摘要

A carrier substrate 105 is provided with a plurality of electronic components 103, each of the electronic components having at least one electrical contact coated with electrically conductive adhesive 102. The carrier substrate 105 is attached to the flexible circuit board 106 such that the electronic components 103 are adhered to the flexible circuit board 106 in electrical contact therewith via the conductive adhesive 102. The conductive adhesive may be applied to the components via a flexible substrate. The components may be attached to the carrier substrate by a thermal release adhesive so that when the conductive adhesive is cured, the carrier substrate is released from the components. The flexible circuit board may be stored on a roll after the electronic components are adhered to it (Fig. 12).