SUBSTRATE PROCESSING APPARATUS, FILM FORMATION UNIT, SUBSTRATE PROCESSING METHOD AND FILM FORMATION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus, film formation unit, substrate processing method and film formation method, capable of forming a metal-containing coating film on a substrate and preventing occurence of metal pollution.SOLUTION: A metal-containing coating film is formed on a target surface by supplying coating liquid containing metal to a target surface of a substrate W by a coating unit 129 as metal-containing coaling liquid. The substrate W after formation of the metal-containing coating film is transferred to a metal removal unit MR by transfer mechanisms 127, 137, 141. Removal liquid for dissolving metal so that the metal-containing coating film remains in other regions than a peripheral edge of the target surface of the substrate W is supplied to the peripheral edge of the substrate W by the metal removal unit MR.SELECTED DRAWING: Figure 1