| 摘要 |
PROBLEM TO BE SOLVED: To reduce damages to a semiconductor chip when a lamination structure of the semiconductor chip is mounted.SOLUTION: A chip laminate TA1 is configured by laminating semiconductor chips P1-P8. A spacer 8 is placed at a position overlapped with at least a part of a pad electrode 10. An encapsulation resin 12 is integrally filled in gaps SP1 and SP2 and integrally encapsulates the chip laminate TA1.SELECTED DRAWING: Figure 1 |
