发明名称 EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in curability and transparency of the epoxy resin composition.SOLUTION: A resin composition contains (A) an epoxy resin, (B) a curing agent, (C) a salt of phosphonium cation represented by the general formula (1) and anion residue of phthalic acids represented by the general formula (2) as a curing accelerator, exhibiting curing behavior with low viscosity at heating initial and steep thermal time rising-up of hardness during curing and becomes colorless transparent when a cured article is acid anhydride.SELECTED DRAWING: Figure 1
申请公布号 JP2016216716(A) 申请公布日期 2016.12.22
申请号 JP20160098830 申请日期 2016.05.17
申请人 HOKKO CHEM IND CO LTD 发明人 OGA MASANORI;OHASHI KENJI
分类号 C08G59/68 主分类号 C08G59/68
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