| 摘要 |
A polishing apparatus for polishing a surface of a workpiece comprises a polishing section (30) for polishing a surface of a workpiece (1), a cleaning section (7,8,9) for cleaning a polished surface of the workpiece, a rotating mechanism (11) for rotating the workpiece (1) during cleaning or after cleaning, a sensor (20) for detecting a reference position (1a) of the workpiece (1), a controller (24) for controlling the rotating mechanism (11) to stop the workpiece (1) against rotation to align the reference position (1a) with a predetermined position based on a detecting signal from the sensor (20), and a film thickness measuring device (70) for measuring a thickness of a polished surface layer of the aligned workpiece (1). <IMAGE> |
