WAFER COLLECTION METHOD AND DOUBLE SIDE POLISHING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wafer collection method capable of preventing a trace of holding a wafer from being generated on a surface of the wafer when holding and collecting the wafer after being subjected to double side polishing.SOLUTION: A wafer collection method is configured to: sandwich a wafer which is held by a carrier with polishing clothes which are stuck to upper and lower mold platens in which a surface of the wafer is the upper mold platen side; make the carrier rotate and revolve; supply a slurry and polish double sides of the wafer simultaneously, then collect the wafer. The method comprises: a step for lifting up the upper mold platen in a state in which, the wafer after being subjected to double side polishing is sucked to the upper mold platen; and a step for holding a rear face of the wafer or edge of the wafer sucked to the upper mold platen, for collecting the wafer.SELECTED DRAWING: Figure 1