发明名称 SLICE DEVICE AND METHOD FOR BRITTLE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a slice device and a method for a brittle substrate capable of generating multiphoton absorption by condensing laser beam 3 at one point, even at an edge of the brittle substrate 1, and forming a modified layer 12 even at the edge of the brittle substrate 1.SOLUTION: A mirror 4 and a condenser lens 5 are arranged so that, laser beam 3 can be radiated to a brittle substrate 1 in a state in which, an optical axis 91 of the laser beam is inclined from an inner peripheral side, then the brittle substrate 1 is rotated using a rotation stage 8, then a condensation point Q in which the laser beam 3 is condensed at inside of the brittle substrate 1 by the condenser lens 5 is scanned over whole periphery of the brittle substrate 1 using an XY stage 7.SELECTED DRAWING: Figure 1
申请公布号 JP2016215231(A) 申请公布日期 2016.12.22
申请号 JP20150102176 申请日期 2015.05.19
申请人 PANASONIC IP MANAGEMENT CORP 发明人 MORI SHIGEYUKI;NAKAI IZURU;KITAMURA YOSHIAKI
分类号 B23K26/53;B28D5/00;B28D5/04;H01L21/304 主分类号 B23K26/53
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