| 摘要 |
The present invention is provided with: a resin layer 2 having, provided therein, a plurality of first slits 6 corresponding to a pattern to be formed on a film formation substrate to have a film formed thereon; and a metal layer 3 which is stacked on the resin layer 2, has second slits 7 provided in positions corresponding to the first slits 6, and has, provided in a plurality of places, with a prescribed interval therebetween, reinforcement parts 4 which intersect and are connected to the second slits 7. Laser processing is performed on the stacked resin layer 2 to remove the resin of the stacked resin layer 2 from reinforcement-part 4 areas of the metal layer 3. The resin layer 2 is provided with a regular opening pattern, and an irregular shielding pattern which divides the opening pattern. As a result, a film formation mask can be provided with which processing in areas directly below the reinforcement parts is facilitated, and with which a regular pattern and an irregular pattern can be easily formed on the film formation substrate. |
