ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electronic device which can inhibit wet spread of an adhesive and achieve downsizing; and provide a manufacturing method of the electronic device.SOLUTION: An electronic device manufacturing method comprises: a conductive material formation process of forming a bump electrode 40 on either one of a pressure chamber formation substrate 29 or a sealing plate 33; an adhesive formation process of forming an adhesion 43 on either one of the pressure chamber formation substrate 29 or the sealing plate 33; a pressurization process of applying pressure in a direction to reduce an interval between the pressure chamber formation substrate 29 and the sealing plate 33 in a state of sandwiching the bump electrode 40 and the adhesive 43 between the pressure chamber formation substrate 29 and the sealing plate 33; a melting process of melting the bump electrode 40 by application of heat; a pressure release process of increasing the interval between the pressure chamber formation substrate 29 and the sealing plate 33 to be larger than the interval in the melting process; and an adhesive curing process of applying heat to a curing temperature of the adhesive 43 in a state of increasing the interval between the pressure chamber formation substrate 29 and the sealing plate 33.SELECTED DRAWING: Figure 4