| 摘要 |
PURPOSE: A composition for manufacturing a thermosetting resin can provide a resin film and prepreg with excellent flame retardance, low thermal expansion rate, low dielectric coefficient, and low moisture absorption. CONSTITUTION: A composition for manufacturing a thermosetting resin includes 100.0 parts by weight of an aromatic polyester amide copolymer and 10-300 parts by weight of an epoxy resin. The aromatic polyester amide copolymer includes 10-35 parts by mole of a repeating unit which has an amine end group and/or a hydroxy end group and is derived from a hydroxycarboxylic acid; 5-20 parts by mole of a repeating unit which is derived from an aromatic amine having a phenolic hydroxy group and/or a repeating unit derived from an aromatic diamine; 10-25 parts by mole of a repeating unit derived from an aromatic diol; 5-15 parts by mole of a repeating unit derived from an aromatic amino carboxylic acid; and 20-40 parts by mole of a repeating unit derived from an aromatic dicarboxylic acid. |
