发明名称 Inter-module communication apparatus
摘要 The invention relates to an inter-module communication apparatus where the reflection is reduced so that the communication channel can provide high speed and broadband as compared to inductive coupling. When modules having a signal line terminated with a terminating member and a feedback signal line are layered on top of each other so that the signal lines are coupled to each other and the return signal lines are coupled to each other using capacitive coupling and inductive coupling, the impedance of the terminating members is a coupling impedance that reflects the proximity effects in the coupling state between the modules.
申请公布号 US9419684(B2) 申请公布日期 2016.08.16
申请号 US201214000350 申请日期 2012.02.14
申请人 KEIO UNIVERSITY 发明人 Kuroda Tadahiro;Ishikuro Hiroki
分类号 H04B5/00 主分类号 H04B5/00
代理机构 Westerman, Hattori, Daniels & Adrian, LLP 代理人 Westerman, Hattori, Daniels & Adrian, LLP
主权项 1. An inter-module communication apparatus, comprising a first module and a second module that are arranged in close proximity so as to face each other, wherein the first module at least includes: a first signal line of which the characteristic impedance has an impedance of Z01;a first feedback signal line for providing a feedback path for the first signal line;a first terminating member that terminates the first signal line and the first feedback signal line; anda first semiconductor integrated circuit apparatus with a transmitting and receiving circuit, the second module at least includes: a second signal line of which the characteristic impedance has an impedance of Z02;a second feedback signal line for providing a feedback path for the second signal line;a second terminating member that terminates the second signal line and the second feedback signal line; anda second semiconductor integrated circuit apparatus with a transmitting and receiving circuit, the impedances of the first terminating member and the second terminating member are coupling impedances that reflect the proximity effects in a coupling state of the first module and the second module, which are different from Z01 and Z02, the first signal line and the second signal line at least partially overlap when projected as viewed in a direction in which the two are layered on top of each other, and the first feedback signal line and the second feedback signal line at least partially overlap when projected as viewed in the direction in which the two are layered on top of each other, signal coupling occurs between the first signal line and the second signal line using capacitive coupling and inductive coupling, and feedback signal coupling occurs between the first feedback signal line and the second feedback signal line using capacitive coupling and inductive coupling, a first insulating substrate and a second insulating substrate are layered on top of each other so that the signal coupling allows a signal from the first signal line to be transmitted through the second signal line, and either a gap between the first signal line and the second signal line or the width of an overlap between the first signal line and the second signal line is different depending on a direction in which signals propagate so that a coupling state between the first signal line and the second signal line is different depending on the direction in which the signals propagate, and wherein frequency characteristics of coupling coefficients for the first signal line and the second signal line are flat.
地址 Tokyo JP