发明名称 THERMOSETTING RESIN COMPOSITION, PREPREG, AND LAMINATED PLATE
摘要 PROBLEM TO BE SOLVED: To provide a laminated plate which is excellent in all of thermal conductivity, reflectivity in visible light region, discoloration resistance, insulation properties, fire retardancy, and drilling properties, and which can be reduced in thickness; and a prepreg used in the laminated plate.SOLUTION: A thermosetting resin composition contains 100-400 pts.wt. of an inorganic filler with respect to 100 pts.wt. of a thermosetting resin; and contains at least titanium dioxide having an average particle diameter of 0.1-1.0 μm and aluminum hydroxide having an average particle diameter of 1.0-20.0 μm, as the inorganic fillers.SELECTED DRAWING: Figure 1
申请公布号 JP2016150959(A) 申请公布日期 2016.08.22
申请号 JP20150028101 申请日期 2015.02.16
申请人 RISHO KOGYO CO LTD 发明人 OKUMURA HIROKI
分类号 C08L101/00;B32B5/28;B32B15/08;C08J5/24;C08K3/22 主分类号 C08L101/00
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