| 摘要 |
PROBLEM TO BE SOLVED: To ensure not only a downsizing technology but also inter-terminal insulation between a positive electrode terminal and a negative electrode terminal by adding a twist in arrangement and alignment of constituent elements, which leads to downsizing of an entire power conversion device.SOLUTION: A power semiconductor module comprises: power semiconductor elements (537 etc.); conductor plates (534, 574) which continue to terminals for supplying DC power to the power semiconductor elements; and a mold resin (507) for covering part of the conductor plates. The terminals and the conductor plates are composed of semiconductor module side positive electrode terminals (532) and negative electrode terminals (572), and a positive electrode side conductor plate (534) and a negative electrode side conductor plate (574). Each of both conductor plates has a principal surface having a width wider than that of another surface and lateral faces each having a width narrower than that of the principal surface. The conductor plates has non-opposite parts where lateral faces of both conductor plates are not opposite to each other, and opposite parts where lateral faces of both conductor plates are opposite to each other. Both conductor plates which form the opposite parts are formed outside the mold resin (507) and a terminal insulation part (396) is arranged between both conductor plates which form the opposite parts. |
