| 摘要 |
The present invention provides a method of mounting an LED chip, which is intended to suppress void-generation inside an eutectic bonding without use of flux. This method comprises a step of eutectically bonding a first metal layer 11 (e.g., AuSn layer) on a rear surface of the LED chip 10, with a metal ground layer 31 on a dielectric substrate (mounting member) 30. This method includes a step of providing a second metal layer 34 having the same metal component as the first metal layer 11, to the top surface of the metal ground layer 31 on a dielectric substrate 30; and subsequently connecting the LED chip 10 and the dielectric substrate 30 by way of eutectically bond while the dielectric substrate 30 is heated at its bottom surface remote from the metal ground layer 31 to melt the second metal layer 34 by heat source (heater or the like). |
