| 摘要 |
PROBLEM TO BE SOLVED: To provide a peeling device and a peeling method of a laminate which can peel a first substrate and a second substrate with reduction in the number of movable bodies, and a manufacturing method of an electronic device.SOLUTION: In a peeling process, power of drive units 48A-48S is transmitted to a flexible plate 52 via long connection members 44A-44S to bend and deform the flexible plate 52, the power of the drive units 48A-48S can be transmitted to the flexible plate 52 in a line or surface manner since the long connection members 44A-44S are interposed between the drive units 48A-48S and the flexible plate 52, thereby a substrate 2 and a reinforcement plate 3 can be peeled by a peeling device 40 in which the number of drive units 48A-48S is reduced.SELECTED DRAWING: Figure 6 |
