超音波トランスデューサー素子パッケージ、プローブ、プローブヘッド、電子機器、超音波診断装置および超音波トランスデューサー素子パッケージの製造方法

摘要

An ultrasonic transducer element package (17) includes a first substrate (32), a second substrate (32), a support body (18), a first ultrasonic transducer and a second ultrasonic transducer. The first substrate (32) has a first opening (43) and a second opening (43) that are aligned in a first direction. The second substrate (32) has a third opening (43) and a fourth opening (43) that are aligned in the first direction. The support body (18) supports the first substrate (32) and the second substrate (32). The first substrate (32) and the second substrate (32) are aligned in a second direction that intersects with the first direction, with a space there between. The first ultrasonic transducer element (28) and the second ultrasonic transducer element (28) are configured at the first opening (43) and the second opening (43) respectively.