PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC DEVICES AND METHOD OF MANUFACTURING THE SAME

摘要

According to the present invention, a printed circuit board having an embedded electronic component comprises: a first insulation layer having a trench formed therein; an electronic component mounted on a lower surface of the trench of the first insulation layer; a second insulation layer formed on an upper portion of the first insulation layer on which the electronic component is mounted; and a circuit layer formed on external surfaces of the first insulation layer and the second insulation layer. When the trench for mounting the electronic component is formed, a corresponding region is replaced by a circuit method to reduce costs during processes.