EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

The present invention relates to an embedded board and a manufacturing method thereof. According to an embodiment of the present invention, the embedded board comprises: an insulation layer; a first circuit layer formed inside the insulation layer; a second circuit layer inside the insulation layer and formed on an upper portion of the first circuit layer; a first electronic component arranged to be separated from a side surface of the second circuit layer inside the insulation layer; a metal filler formed between the first circuit layer and the second circuit layer or the first electronic component; and a first via formed inside the insulation layer and formed on an upper portion of the second circuit layer. Therefore, the embedded board can improve a flowing feature of a molding material.