| 摘要 |
An electronic device, provided with a heat dissipation member, a power element thermally coupled to the heat dissipation member, and a first electroconductive layer to which the power element is electrically coupled. The electronic device is further provided with a control element for controlling the switching operation of the power element, a second electroconductive layer to which the control element is electrically coupled, and a resin layer disposed between the first electroconductive layer and the second electroconductive layer and in which the power element is embedded. The first electroconductive layer, the resin layer, and the second electroconductive layer are layered in the sequence listed from the side nearest to the heat dissipation member. |
