Method for Manufacturing Electronic Component

摘要

A method for manufacturing an electronic component having a flexible structure includes the steps of: forming an integrated circuit element package having a foldable and expandable flexible structure, the integrated circuit element package including a first substrate having a foldable and expandable, flexible structure and having a structure on which a heat transfer part capable of transferring heat is patterned, an integrated circuit element having a foldable and expandable, flexible structure and having a first pad of which one surface is electrically connectable, and an adhesive film having a foldable and expandable, flexible structure, which is disposed between the substrate and the integrated circuit element so that the substrate and the integrated circuit element can be adhered to each other; forming a second substrate having a foldable and expandable, flexible structure and having a second pad of which one surface is electrically connectable; and performing a thermo-compression process so as to adhere the integrated circuit element package to the second substrate while electrically connecting the first pad of the integrated circuit element with the second pad of the second substrate through surface contact.

主权项

1. A method for manufacturing an electronic component having a flexible structure, the method comprising:
forming an integrated circuit element package having a bendable or unfoldable and flexible structure, the integrated circuit element package including a first substrate, which has a bendable or unfoldable and flexible structure and has a structure, in which a heat transfer part capable of transferring heat is patterned, an integrated circuit element, which has a bendable or unfoldable and flexible structure and one surface of which is provided with an electrically connectable first pad, and an adhesive film, which has a bendable or unfoldable and flexible structure and is provided between the substrate and the integrated circuit element so that the substrate is bonded to the integrated circuit element; forming a second substrate, which has a bendable or unfoldable and flexible structure and one surface of which is provided with an electrically connectable second pad; and performing a thermo-compression process so as to make the first pad of the integrated circuit element be in surface-contact with the second pad of the second substrate and electrically connect the first pad of the integrated circuit element and the second pad of the second substrate, and make the integrated circuit element package be in contact with the second substrate, in which heat is transferred from the first substrate to the second substrate through the heat transfer part when the thermo-compression process is performed, wherein the first substrate includes a polyimide (PI) film, the integrated circuit element has a thickness of 1 to 50 μm, in which the integrated circuit element is bendable or unfoldable, and the adhesive film includes a double-sided tape or a die bonding attach film.