| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem in chemical mechanical polishing which involves the determination of whether a substrate layer has been flattened to a desired flatness or thickness, or when a desired amount of material has been removed.SOLUTION: A polishing method includes: a step of polishing a substrate; and a step of receiving identification information of a spectrum feature which is selected as the one to be monitored during polishing, and characteristics of the spectrum feature thus selected. The method further includes: a step of measuring a series of spectra of light reflected from the substrate while the substrate is being polished, in which the series of spectra is different in at least a part because the material is removed during polishing; a step of determining a characteristic value of the selected spectrum feature with respect to each spectrum in the series of spectra and generating a series of values for the characteristics; a step of matching a function with the series of values; and a step of determining polishing termination point or adjustment on polishing speed on the basis of the function.SELECTED DRAWING: Figure 9 |
