| 摘要 |
The present invention provides a three-dimensional measurement device capable of carrying out three-dimensional measurement using a phase shift method with higher accuracy and in a shorter period of time. A substrate inspection device 1 is provided with an illumination device 4 for irradiating a striped light pattern onto a printed circuit board 2, a camera 5 for imaging the portion of the printed circuit board 2 irradiated with the light pattern, and a control device 6 for carrying out three-dimensional measurement on the basis of the imaged image data. The control device 6 calculates a first height measurement value on the basis of image data obtained by irradiating a first optical pattern having a first period onto a first position and acquires gain and offset values from the image data. Further, the control device 6 uses the gain and offset values to calculate a second height measurement value on the basis of image data obtained by irradiating a second optical pattern having a second period onto a second position that is diagonally offset by a half-pixel pitch. Height data specified on the basis of the first measurement value and second measurement value is acquired as real height data. |
