| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is excellent in tackiness after application and drying, can be microfabricated because of its photosensitivity, can obtain a cured film with excellent flexibility, fire retardancy, and electrical insulation reliability, and has low post-curing warpage of a substrate, and a resin film, an insulator film and a print circuit board with the insulator film.SOLUTION: A photosensitive resin composition at least contains (A) a binder polymer, (B) crosslinked polymer particles having an urethane bond and a radical polymerizable group within a molecule, (C) a compound having a radical polymerizable group within a molecule, and (D) a photopolymerization initiator. |
