发明名称 |
POLISHING ABRASIVE PARTICLE, PRODUCTION METHOD THEREFOR, POLISHING METHOD, POLISHING DEVICE, AND SLURRY |
摘要 |
[Object] The present invention is objected to polish the surface of the object material with a high quality at a high polishing rate. [Solution] The object surface is polished using a wet polishing method. Slurry is produced by scattering abrasive particles into pure water. In the abrasive particle, where components which has a mechanochemical effect and which reacts to the friction heat generated in polishing the object material are joined with each other and integrated to a particle. There, respective component is joined with each other using a mechanical alloying process, while maintaining the inherent material properties. When the slurry is used in a lapping process of sapphire, silicon carbide, gallium nitride and the like, the polishing process can be substantially shortened and the processing cost is drastically reduced. Further, it secures a high quality of the polishing surface. The abrasive particle can be used repeatedly in the polishing process. Since the pH value of the slurry is around 3 to 9, it does not deteriorate working environment and the liquid-waste treatment is easy. |
申请公布号 |
EP3103851(A1) |
申请公布日期 |
2016.12.14 |
申请号 |
EP20150746755 |
申请日期 |
2015.01.19 |
申请人 |
Asahi Kasei Kogyo Co., Ltd. |
发明人 |
FUJIMOTO Shunichi;YAMASHITA Tetsuji |
分类号 |
C09K3/14;B24B1/00;B24B37/00;C09G1/02;H01L21/304 |
主分类号 |
C09K3/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|