| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting diode chip which is not affected by a mounting direction and is manufactured at low cost, and to provide a division processing method of a wafer into a chip. <P>SOLUTION: In the light-emitting diode chip, a semiconductor film 2 including a light-emitting layer is laminated in one surface of a transparent substrate 1 having two back-to-back surfaces, and unevenness is formed in a chip dividing surface 12 which is orthogonal to the two back-to-back surfaces. In the division processing method, an optical beam induced destructive region along a division line is formed in the inside of the substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT |
