| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of mounting a lead-free solder joint material which can be mounted at low temperature and has ductility, and a printed wiring board manufactured using the same.SOLUTION: A method of mounting a lead-free solder joint material includes the steps of: manufacturing a substrate 1 which has an insulation layer with an opening part formed and an Sn-Bi-based solder layer formed in the opening part after forming a copper plating layer on the substrate and includes Sn-Ag-Cu-based solder thereupon; manufacturing a substrate 2 which has an insulation layer with an inversely tapered opening part formed after an electrode layer is formed on a base material different from the base material, and also has an Sn-Bi-based solder bump formed in the opening part; aligning the opening part of the insulation layer of the substrate 1 and the opening part of the insulation layer of the substrate 2 with each other and heating and joining the substrates at temperature lower than the fusion point of Sn-Ag-Cu-based solder; transferring a solder layer from the substrate 1 onto the Sn-Bi-based solder bump provided on the substrate 2; and transferring the layer having been transferred to the substrate 2 to a mounting substrate. |
