发明名称 HEAT EVALUATION DEVICE AND HEAT EVALUATION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a technology for enabling an electronic equipment designer to relatively easily measure the terminal part temperature approximate value of a resistor on the basis of a thermal image obtained by an infrared thermograph.SOLUTION: The heat evaluation method of an electronic component having a terminal part using an infrared thermograph device includes steps of: measuring the temperature distribution of the electronic component as first data from an infrared image captured by a predetermined magnification ratio; performing filtering processing to the first data to calculate second data; and calculating the temperature of the terminal part from a value indicating a peak temperature in the second data.SELECTED DRAWING: Figure 5
申请公布号 JP2016206114(A) 申请公布日期 2016.12.08
申请号 JP20150090653 申请日期 2015.04.27
申请人 KOA CORP 发明人 HIRASAWA KOICHI
分类号 G01J5/48;G01R31/26 主分类号 G01J5/48
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