TRANSPARENT ELECTROSTATIC CARRIER

摘要

Embodiments described herein provide an electrostatic carrier for transferring a substrate. The electrostatic carrier may have a transparent body. The transparent body may have a first surface sized to transport the substrate into and out of a processing chamber. The electrostatic carrier may also have one or more electrostatic chucking electrodes coupled to the transparent body. The one or more electrostatic chucking electrodes may include a transparent conductive oxide material. In certain embodiments the transparent conductive oxide material is an indium-tin oxide material.

主权项

1. An electrostatic carrier for transferring a substrate, the electrostatic carrier comprising:
a transparent body having a first surface sized to transport the substrate into and out of a processing chamber; one or more electrostatic chucking electrodes coupled to the transparent body; and a transparent cover disposed on the transparent body, wherein the transparent body, the one or more electrostatic chucking electrodes, and the transparent cover form a unitary structure sized to transfer the substrate through a semiconductor slit valve door.