| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for mounting an electronic component, the package being able to satisfactorily dissipate heat generated from an electronic component and able to achieve high reliability, and to provide an electronic device using the same.SOLUTION: A package 1 for mounting an electronic component comprises: a heat sink 6 in which a first metal plate 2 and second metal plates 3, 4 are arranged in layers; and a tubular package body 7 made of synthetic resin. The Young's modulus of each second metal plate 3, 4 is smaller than the Young's modulus of the first metal plate 2. The first metal plate 2 has a projection part 2a projecting outwards in a planar direction parallel to its principal surface, the projecting part 2a projecting further outwards than the outer edge of each second metal plate 3, 4 in a plan view. This projection part 2a is embedded in the package body 7 from the inner peripheral surface 7b of the end part 7a of the package body 7 on one of the sides thereof, and the principal surface of each second metal plate 3, 4 of the heat sink 6 is fixed to the end part 7a on the one of the sides so as to close one of openings in the package body 7.SELECTED DRAWING: Figure 4 |
