| 摘要 |
PROBLEM TO BE SOLVED: To reduce nipping of foreign matters between a mold and a substrate when the mold and an imprint material are brought into contact.SOLUTION: An imprint apparatus 100, forming a pattern on a substrate 4 by contacting and separating a mold 9 and an imprint material 4a on a substrate 4, includes capturing means so configured that a capturing area 31a, for capturing foreign matters 20 with an electrostatic force, surrounds a holding section for holding an arrangement space for the substrate 4 or the substrate 4.SELECTED DRAWING: Figure 1 |
