| 摘要 |
PROBLEM TO BE SOLVED: To provide a spraying method using a supply system which can prevent the formation of a residual material. SOLUTION: In the spraying method to prevent the residual material using the supplying system 116, an exact rate of a fluidized fluid is sprayed on a wafer by supplying the fluidized fluid as continuous one flow in the exact rate from a fluid supply machine 100 to a nozzle 108 through a main tube 102. A void 107 is re-filled with the fluid using a sub-tube system having a bypass valve 112c and a pinhole part 106. A measuring valve 112b, as a suction return system to recover the fluid remaining inside the main tube 102, is used for the residual material so as not to remain. |
