发明名称 |
PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE TAPE |
摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive composition which has pressure-sensitive adhesiveness at ordinary temperature and undergoes a curing reaction to develop increased bonding strength when heated and a pressure- sensitive adhesive tape coated therewith. SOLUTION: There is provided a pressure-sensitive adhesive composition comprising a (meth)acrylate copolymer comprising a (meth)acrylic ester (a) in which the ester moiety is an aliphatic or aromatic hydrocarbon compound, an ether-bond-containing (meth)acrylic ester (b) and a functional-group-containing monomer (c) and a phenolic resin. This composition is applied to at least either surface of a support 2 to form a pressure-sensitive adhesive layer 3, and a release layer 4 is formed thereon to form a pressure-sensitive adhesive tape 1. The mixing ratio among components (a), (b) and (c), a/b/c, is (0-94)/(5-99.9)/(0.1-20). |
申请公布号 |
JPH10324857(A) |
申请公布日期 |
1998.12.08 |
申请号 |
JP19970135576 |
申请日期 |
1997.05.26 |
申请人 |
SOKEN CHEM & ENG CO LTD;LINTEC CORP |
发明人 |
SUWA TATSUHIRO;YAMAGISHI TOSHIMASA;NODE SHUNSAKU |
分类号 |
C09J7/02;C09J133/06;C09J133/14;(IPC1-7):C09J133/06 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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