IC die with channel circuitry, scan and BIST taps, TLM

摘要

Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

主权项

1. An integrated circuit die, comprising:
(a) channel circuitry having a channel interface that includes:
(i) a bidirectional data input/output path for a test mode select signal, a test data in signal, and a test data out signal;(ii) a clock input lead, and(iii) a linking module interface that includes a test mode select output lead, a test data in output lead, a test data out input lead, and a test clock output lead; (b) a scan TAP domain connected to combinational logic and having a TAP interface that includes a test mode select input, a test data input, a test clock input, and a test data output; and (c) a BIST TAP domain connected to the combinational logic and having a TAP interface that includes a test mode select input, a test data input, a test clock input, and a test data output; and (d) TAP linking module circuitry having a first interface connected to the linking module interface of the channel circuitry, a second interface connected to the TAP interface of the scan TAP domain, and a third interface connected to the TAP interface of the BIST TAP domain.