Turret handlers and methods of operations thereof

摘要

In one embodiment, a method of testing a semiconductor component includes loading a plurality of semiconductor components into a main turret of a turret handler, transporting the plurality of semiconductor components using the main turret to a test area, and splitting the plurality of semiconductor components into a first set and a second set. The method further includes testing a first semiconductor component in the first set at a first test pad using a tester while transporting a second semiconductor component in the second set to a second test pad and testing the second semiconductor component using the tester while transporting the first semiconductor component out of the first test pad. The first set and the second set are merged into the plurality of semiconductor components and the plurality of semiconductor components are transported away from the test area using the main turret.

主权项

1. A method of testing a semiconductor component, the method comprising:
loading a plurality of semiconductor components into a main turret of a turret handler; transporting the plurality of semiconductor components using the main turret to a test area; splitting the plurality of semiconductor components into a first set and a second set, wherein splitting the plurality of semiconductor components into a first set and a second set comprises transporting the first set from the main turret to a first secondary turret and transporting the second set from the main turret to a second secondary turret, wherein the first secondary turret and the second secondary turret are configured to move independently, wherein the first secondary turret, the second secondary turret and the main turret share a common rotational axis; using a tester, testing a first semiconductor component in the first set at a first test pad while transporting a first semiconductor component in the second set to a second test pad; using the tester, testing the first semiconductor component while transporting the first semiconductor component in the first set out of the first test pad; and merging the first set and the second set and transporting the plurality of semiconductor components away from the test area using the main turret.