RELEASE HOLE PLUS CONTACT VIA FOR FINE PITCH ULTRASOUND TRANSDUCER INTEGRATION

摘要

Methods, systems, computer-readable media, and apparatuses for high density Micro-Electro-Mechanical Systems (MEMS) are presented. In some embodiments, a method for manufacturing a micro-electro-mechanical device on a substrate can comprise etching a release via through a layer of the device. The method can further comprise creating a cavity in the layer of the device using the release via as a conduit to access the desired location of the cavity, the cavity enabling movement of a transducer of the device. The method can then comprise depositing low impedance, electrically conductive material into the release via to form an electrically conductive path through the layer. Finally, the method can comprise electrically coupling the electrically conductive material to an electrode of the transducer.

主权项

1. A method for manufacturing a micro-electro-mechanical device on a substrate, comprising:
etching a release via through a layer of material formed on the substrate; creating a cavity in the layer of the device using the release via as a conduit to access a desired location of the cavity, the cavity enabling movement of a transducer of the device; depositing an electrically conductive material into the release via to form an electrically conductive path through the layer; and electrically coupling the electrically conductive material to an electrode of the transducer.