发明名称 INFRARED SENSOR ARRAY CIRCUIT BREAKER AND HOTSPOT MONITORING
摘要 A thermal monitoring system includes at least one of an infrared sensor and a plurality of infrared sensors arranged in an array. Each infrared sensor has a resolution including a plurality of pixels. A controller is configured to create a thermal image of an area to be monitored based at least in part on the plurality of pixels of each infrared sensor. A thermal monitoring assembly includes an electrical panel including a plurality of electrical components located within the electrical panel. The at least one of an infrared sensor and the plurality of infrared sensors arranged in an array, either alone or in combination with additional sensors, are located inside the electrical panel. Methods of monitoring various parameters including a temperature of the plurality of electrical components located inside the electrical panel are also provided.
申请公布号 WO2017040886(A1) 申请公布日期 2017.03.09
申请号 WO2016US50042 申请日期 2016.09.02
申请人 COOPER TECHNOLOGIES COMPANY 发明人 FREER, Benjamin, Avery;IANNCE, Stephan, P.;MANAHAN, Joseph, Michael;ROTHENBERGER, Rick;BONACCIO, John;KATHUROJU, Pavan, Kumar;BARJATYA, Amit;KSHIRSAGAR, Abhijeet, V;DHARNE, Gayatri, Shashikant
分类号 G01R31/12;G01J5/20;G01R15/18;H02B1/24;H04N5/33 主分类号 G01R31/12
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