SELF-ADHESIVE FILM FOR PROTECTING SEMICONDUCTOR WAFER AND SURFACE PROTECTING METHOD USING THE SAME

摘要

PURPOSE: To provide a self-adhesive film for protecting a semiconductor wafer capable of protecting the surface of a semiconductor wafer electronic circuit at the time of the processing of the semiconductor wafer and capable of being easily peeled only by heating without applying radiation at a time of peeling and damaging an IC memory. CONSTITUTION: A self-adhesive film is bonded to a semiconductor wafer at temp. equal to or higher than the m.p. of a self-adhesive to perform the processing of the semiconductor wafer in the vicinity of the m.p. of the self-adhesive and heated for several sec to be peeled and removed from the semiconductor wafer. The bonding strength of the self-adhesive film becomes high to a certain degree in the vicinity of the m.p. of the self-adhesive and becomes low at the high temp. heating and peeling the self-adhesive film and 20-80wt.% of the monomer constituting the self-adhesive is composed of a comb-shaped polymer having a 8 or more C side chain and the base material of the self-adhesive film is constituted of a plastic film having heat shrinkability.