| 摘要 |
In one embodiment, the method produces light-emitting diode filaments (10) and comprises the steps: A) fitting light-emitting diode chips (3) directly onto a first carrier (1), B) covering the light-emitting diode chips (3) with a second carrier (2), C) encapsulating the light-emitting diode chips (3) with a potting body (4) by injection moulding to form a cohesive filament composite (40), wherein the two carriers (1, 2) are used as moulds, and wherein the potting body (4) is integrally formed directly onto the light-emitting diode chips (3), D) removing the first carrier (1) or the second carrier (2) or both carriers (1, 2), E) fitting electrical connections (5) to the potting body (4) and between the light-emitting diode chips (3), so that the light-emitting diode chips (3) are electrically interconnected, and F) separating the filament composite (40) to form the light-emitting diode filaments (10), wherein each of the finished light-emitting diode filaments (10) is mechanically self-supporting, comprises at least eight of the light-emitting diode chips (3) and has a ratio of length to width of at least 15. |
