发明名称 THERMOELECTRIC CONVERSION MATERIAL AND THERMOELECTRIC CONVERSION MODULE
摘要 The present invention provides a thermoelectric conversion material that has low thermal conductivity and that is stable at a high temperature, and a thermoelectric conversion module using the same. The thermoelectric conversion material includes a granular base material including a semiconductor, a fine particle with a guest material distributed in the granular base material, and a binder with the guest material on a grain boundary of the granular base material. An amount of the binder is equal to or smaller than an amount of the fine particle, an amount of the granular base material is larger than a total amount of the binder and the fine particle, and the semiconductor and the guest material are in an isolated state not forming a compound by a eutectic reaction, a eutectoid reaction, a peritectic reaction, a peritectoid reaction, a monotectic reaction, or a segregation reaction.
申请公布号 US2017069811(A1) 申请公布日期 2017.03.09
申请号 US201615252825 申请日期 2016.08.31
申请人 HITACHI, LTD. 发明人 KUROSAKI Yosuke;YABUUCHI Shin;HAYAKAWA Jun
分类号 H01L35/04;H01L35/18;H01L35/22;H01L35/16 主分类号 H01L35/04
代理机构 代理人
主权项 1. A thermoelectric conversion material comprising: a granular base material including a semiconductor; a fine particle with a guest material dispersed in the granular base material; and a binder with the guest material on a grain boundary of the granular base material, wherein an amount of the binder is equal to or smaller than an amount of the fine particle, an amount of the granular base material is larger than a total amount of the binder and the fine particle, and the semiconductor and the guest material are in an isolated state not forming a compound by a eutectic reaction, a eutectoid reaction, a peritectic reaction, a peritectoid reaction, a monotectic reaction, or a segregation reaction.
地址 Tokyo JP