| 发明名称 |
METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE |
| 摘要 |
Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka "slurry") and an abrasive pad, e.g., CMP processing. |
| 申请公布号 |
WO2017040571(A1) |
申请公布日期 |
2017.03.09 |
| 申请号 |
WO2016US49563 |
申请日期 |
2016.08.31 |
| 申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
CUI, Ji;LAM, Viet;GRUMBINE, Steven |
| 分类号 |
C09G1/02;C09K3/14;H01L21/306;H01L21/321 |
主分类号 |
C09G1/02 |
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