发明名称 |
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PROCESSING, AND METHOD FOR MANUFACTURING THIN WAFER |
摘要 |
A temporary adhesive material for a wafer processing, used for temporarily bonding a support and a wafer having a circuit-forming front surface and a back surface to be processed, contains a complex temporary adhesive material layer having a three-layered structure that includes a first temporary adhesive layer composed of a non-silicone thermoplastic resin layer capable of releasably adhering to the front surface of the wafer, a second temporary adhesive layer composed of a thermosetting siloxane polymer layer laminated on the first temporary adhesive layer, and a third temporary adhesive layer composed of a thermosetting siloxane-modified polymer layer laminated on the second temporary adhesive layer and capable of releasably adhering to the support. A wafer processing laminate and temporary adhesive material for a wafer processing facilitate temporary adhesion and separation, have excellent CVD resistance, and can increase productivity of thin wafers, and a method manufactures a thin wafer using the same. |
申请公布号 |
US2017069521(A1) |
申请公布日期 |
2017.03.09 |
申请号 |
US201515122493 |
申请日期 |
2015.03.03 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
SUGO Michihiro;YASUDA Hiroyuki;TAGAMI Shohei;TANABE Masahito |
分类号 |
H01L21/683;C09J183/04;B32B37/12;B32B27/08;B32B27/28;C08G77/20;H01L23/00 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Tokyo JP |