发明名称 Integrated Circuitry and Methods of Forming Transistors
摘要 Some embodiments include integrated circuits having first and second transistors. The first transistor is wider than the second transistor. The first and second transistors have first and second active regions, respectively. Dielectric features are associated with the first active region and break up the first active region. The second active region is not broken up to the same extent as the first active region. Some embodiments include methods of forming transistors. Active areas of first and second transistors are formed. The active area of the first transistor is wider than the active area of the second transistor. Dielectric features are formed in the active area of the first transistor. The active area of the first transistor is broken up to a different extent than the active area of the second transistor. The active areas of the first and second transistors are simultaneously doped.
申请公布号 US2017069538(A1) 申请公布日期 2017.03.09
申请号 US201615357602 申请日期 2016.11.21
申请人 Micron Technology, Inc. 发明人 Smith Michael A.
分类号 H01L21/8234;H01L29/78;H01L29/06;H01L21/265;H01L29/66;H01L27/115 主分类号 H01L21/8234
代理机构 代理人
主权项
地址 Boise ID US